JPH0715151Y2 - 混成集積回路装置のケース構造 - Google Patents
混成集積回路装置のケース構造Info
- Publication number
- JPH0715151Y2 JPH0715151Y2 JP1989017046U JP1704689U JPH0715151Y2 JP H0715151 Y2 JPH0715151 Y2 JP H0715151Y2 JP 1989017046 U JP1989017046 U JP 1989017046U JP 1704689 U JP1704689 U JP 1704689U JP H0715151 Y2 JPH0715151 Y2 JP H0715151Y2
- Authority
- JP
- Japan
- Prior art keywords
- case
- integrated circuit
- circuit device
- slit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003466 welding Methods 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 239000012815 thermoplastic material Substances 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- 230000002093 peripheral effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989017046U JPH0715151Y2 (ja) | 1989-02-16 | 1989-02-16 | 混成集積回路装置のケース構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989017046U JPH0715151Y2 (ja) | 1989-02-16 | 1989-02-16 | 混成集積回路装置のケース構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02108367U JPH02108367U (en]) | 1990-08-29 |
JPH0715151Y2 true JPH0715151Y2 (ja) | 1995-04-10 |
Family
ID=31230502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989017046U Expired - Lifetime JPH0715151Y2 (ja) | 1989-02-16 | 1989-02-16 | 混成集積回路装置のケース構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0715151Y2 (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0412678Y2 (en]) * | 1986-05-06 | 1992-03-26 |
-
1989
- 1989-02-16 JP JP1989017046U patent/JPH0715151Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH02108367U (en]) | 1990-08-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8472197B2 (en) | Resin-sealed electronic control device and method of fabricating the same | |
EP1806960A1 (en) | Electronic device | |
CN102833970A (zh) | 电控单元 | |
JP6990693B2 (ja) | 回路基板アセンブリ | |
US7732937B2 (en) | Semiconductor package with mold lock vent | |
JPH0715151Y2 (ja) | 混成集積回路装置のケース構造 | |
JP4233465B2 (ja) | フレキシブル基板への電子部品取付構造 | |
JPH0515445U (ja) | 複合半導体装置 | |
JP3755540B2 (ja) | 電子回路容器 | |
JPH09293804A (ja) | 電子機器の封止構造 | |
KR100374683B1 (ko) | 에어-캐비티형 패캐지 및 그 제조방법 | |
JP2798861B2 (ja) | 混成集積回路装置 | |
JP2540345B2 (ja) | 半導体パッケ―ジの製造方法 | |
JP2972112B2 (ja) | 電力半導体装置 | |
JPH06334070A (ja) | 混成集積回路装置 | |
JP2500863Y2 (ja) | 電子部品の固定構造 | |
JPS6211005Y2 (en]) | ||
KR100280597B1 (ko) | 반도체장치와반도체장치유닛및반도체장치유닛의제조방법 | |
JPH0623254U (ja) | 基板の固定構造 | |
JPS5837694B2 (ja) | 半導体装置 | |
JP7067264B2 (ja) | 電子装置 | |
JP2760608B2 (ja) | 封止型混成集積回路装置 | |
JP2025104523A (ja) | カメラ装置およびカメラ装置の製造方法 | |
CN119833404A (zh) | 传感器封装结构及其制造方法 | |
JPH0530363Y2 (en]) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |